制作印刷電路板的基礎(chǔ)材料，需進(jìn)行系列物化性能分析。電子制造中用于柔性電路和PCB的薄金屬片。
| 標(biāo)準(zhǔn)號(hào) & 類別 | 標(biāo)準(zhǔn)名稱 | 發(fā)布 |
|---|---|---|
| ASTM B451-93 Array |
Specifications for copper foil, strip and sheet
電鍍 |
1993 美國材料與試驗(yàn)協(xié)會(huì) |
| ASTM D2861-14 Test Method |
銅箔與介電薄膜或經(jīng)處理的織物構(gòu)成的撓性復(fù)合材料的標(biāo)準(zhǔn)試驗(yàn)方法 Standard Test Methods for Flexible Composites of Copper Foil with Dielectric Film or Treated Fabrics
|
2014 美國材料與試驗(yàn)協(xié)會(huì) |
| ASTM RR-E28-1007 1986 試驗(yàn) |
E0796-金屬箔延展性測(cè)試的標(biāo)準(zhǔn)測(cè)試方法 E0796-Standard Test Method for Ductility Testing of Metallic Foil
|
1986 美國材料與試驗(yàn)協(xié)會(huì) |
| BS EN 1653:1998(2001) 規(guī)范 |
銅及銅合金——適用于鍋爐、壓力容器和熱水儲(chǔ)存裝置的板、帶和圓盤 Copper and copper alloys D Plate, sheet and circles for boilers, pressure vessels and hot water storage units
|
2001-05-01 英國標(biāo)準(zhǔn)學(xué)會(huì) |
| BS EN 61249-2-11:2003(2006) 試驗(yàn)規(guī)范 |
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad — Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical b
|
2004-02-19 英國標(biāo)準(zhǔn)學(xué)會(huì) |
| BS EN 61249-2-5:2003(2006) 規(guī)范 |
Materials for printed circuit boards and other interconnect structures Part 2-5: Reinforcement base materials with copper and copper-free Brominated epoxy phenolic paper reinforcement core/braided E-glass surface reinforcement Definitions Flammability (ve
|
2006-01-01 英國標(biāo)準(zhǔn)學(xué)會(huì) |
| GB/T 29847-2013 試驗(yàn)方法 |
Test methods for copper foil used for printed boards
|
2013-11-12 國家質(zhì)檢總局 |
| GB/T 29847-2025 試驗(yàn)方法 |
Test methods for copper foil for printed circuit boards
|
2025-03-28 國家質(zhì)檢總局 |
| IPC 4101E-2017- 規(guī)范標(biāo)準(zhǔn) |
Specification for base materials for rigid and multilayer printed circuit boards
層壓板 預(yù)浸料 |
2017-03-01 美國電子電路和電子互連行業(yè)協(xié)會(huì) |
| IPC 4562A-2016 規(guī)范標(biāo)準(zhǔn) |
Metal Foil for Printed Board Applications
|
2016-1-1 美國電子電路和電子互連行業(yè)協(xié)會(huì) |
| JIS C 6515:1998 規(guī)范標(biāo)準(zhǔn) |
Copper foil for printed wiring boards
|
1998-10-20 日本工業(yè)標(biāo)準(zhǔn)調(diào)查會(huì) |
| SAE AMS3613E-2016 規(guī)范標(biāo)準(zhǔn) |
Film@ Copper Clad Polyester
|
2016-11-01 美國機(jī)動(dòng)車工程師協(xié)會(huì) |
| SJ/T 11483-2014 規(guī)范 |
Electrodeposited copper foil for lithium ion battery
|
2014-10-14 行業(yè)標(biāo)準(zhǔn)-電子 |
| T/ZZB 2017-2020 規(guī)范 |
Aluminum basecopper-clad laminates for printed circuits
|
2020-12-30 中國團(tuán)體標(biāo)準(zhǔn) |
| UNE-EN 61249-2-43:2016 規(guī)范標(biāo)準(zhǔn) |
印刷板和其他互連結(jié)構(gòu)的材料 第2-43部分：包覆和未包覆的增強(qiáng)基材 具有規(guī)定可燃性的非鹵化環(huán)氧纖維素紙/編織 E 玻璃增強(qiáng)層壓板 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test),...
|
2016-08-01 西班牙標(biāo)準(zhǔn)化協(xié)會(huì) |
| UNE-EN IEC 61249-2-46:2018 規(guī)范標(biāo)準(zhǔn) |
Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m?K) and defined ...
|
2018-05-01 西班牙標(biāo)準(zhǔn)化協(xié)會(huì) |
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